Heat dissipation substrate and utilize shell of this heat dissipation substrate

The utility model relates to a heat dissipation substrate and utilize shell of this heat dissipation substrate. A heat dissipation substrate, is applicable to and dispels the heat to a heat source to it can carry out radiating lamellar body with heat conduction manner to contain one, and this lamell...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lin Qiulang, Xie Lizhen
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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