Heat dissipation substrate and utilize shell of this heat dissipation substrate
The utility model relates to a heat dissipation substrate and utilize shell of this heat dissipation substrate. A heat dissipation substrate, is applicable to and dispels the heat to a heat source to it can carry out radiating lamellar body with heat conduction manner to contain one, and this lamell...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to a heat dissipation substrate and utilize shell of this heat dissipation substrate. A heat dissipation substrate, is applicable to and dispels the heat to a heat source to it can carry out radiating lamellar body with heat conduction manner to contain one, and this lamellar body has the convex deformation portion of at least one this heat source of orientation, and this deformation portion has a plane of reflection formed at the surface, and this plane of reflection can reflect from the radiant heat of this heat source with this the heat dissipation substrate transmission of radiation mode orientation. An utilize the shell of this heat dissipation substrate, is applicable to and dispels the heat to a heat source to contain a casing, and attached this heat dissipation substrate in this casing, the plane of reflection of this deformation portion can reflect the radiant heat that transmits from this heat source with the radiation mode. This heat dissipation substrate can be with refle |
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