Packaging structure and intermediary's board thereof

The utility model provides a packaging structure and intermediary's board thereof, this intermediary's board of includes: an encapsulated layer and inlay and bury in this encapsulated layer and expose in a plurality of lead body of this encapsulated layer to through simple and easy this lead body of current routing joint mode preparation, thus compare in the processing procedure of current silicon intermediary board, the utility model discloses an intermediary's board can reduce the cost of manufacture by a wide margin. 种封装结构及其中介板，该中介板包括：封装层、以及嵌埋于该封装层中并外露于该封装层的多个导线体，以通过简易的现有打线接合方式制作该导线体，故相比于现有硅中介板的制程，本实用新型的中介板能大幅降低制作成本。