Chemical mechanical grinding device

The utility model relates to a chemical mechanical grinding device, chemical mechanical grinding device includes: the grinding pad, it contacts with the base plate in chemical mechanical polishing technology, temperature regulation portion, it sets up in the upper portion of grinding pad with the spaced form, and with the surface temperature of grinding pad is adjusted to the fluid that exists above the grinding pad for the media, chemical mechanical grinding device can adjust the temperature of grinding pad uniformly. 本实用新型涉及种化学机械研磨装置，化学机械研磨装置包括：研磨垫，其在化学机械研磨工艺中与基板接触；温度调节部，其以间隔的形式设置于研磨垫的上部，并以所述研磨垫的上面存在的流体为媒介调节研磨垫的表面温度，所述化学机械研磨装置能够均匀地调节研磨垫的温度。