Impedance arrangement structure

The utility model provides an impedance arrangement structure, include: the dielectric layer includes that a surface circuit lays the district, the 2nd surface circuit lays district, first surface pair border area and the vice border area of second surface, and wherein, a surface circuit lays the district and is laid the district by second surface pair border area encirclement by first surface vice border area encirclement, the 2nd surface circuit, circuit metal pattern layer, attached to a surface circuit lay the district and/or the 2nd surface circuit lay the district, vice limit copper layer is attached to the vice border area of second surface, the impedance line is attached to the first surface vice border area and region that vice limit copper layer corresponds. The utility model discloses with the marginal portion of impedance strip setting at the circuit board to utilize vice limit copper layer to spread copper to existing second surface vice border area and handle, so neither influence the utilizatio