CMOS image sensor spare

The utility model discloses a CMOS image sensor spare, including image sensing chip, transparent cover, this image sensing chip's upper surface has a sense light zone, thereby have the cofferdam of support vacuole formation between transparent cover and image sensing chip between transparent co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a CMOS image sensor spare, including image sensing chip, transparent cover, this image sensing chip's upper surface has a sense light zone, thereby have the cofferdam of support vacuole formation between transparent cover and image sensing chip between transparent cover edge and image sensing chip's the upper surface edge, this supports and passes through the bonding of glue layer between cofferdam and the image sensing chip, and the fringe region all around of image sensing chip lower surface distributes and has a plurality of blind hole, the blind hole is described the hole by the bowl and is constituteed with a straight hole that is located bowl form hole bottom portion, the upper shed in bowl form hole is 120~130 mu m in the blind hole, and the under shed is 62~68 mu m, and the bore depth is 40~45 microns. The utility model discloses CMOS image sensor spare reduces the structural stress, has improved the stability of yield with the electrical property, has shortened the technol