Washing anchor clamps of semiconductor device braid packing encapsulation head
The utility model provides a washing anchor clamps of semiconductor device braid packing encapsulation head, including clamping part and locking screw, be provided with the first groove of encapsulation on the clamping part, the both sides that just encapsulate first groove still are provided with s...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The utility model provides a washing anchor clamps of semiconductor device braid packing encapsulation head, including clamping part and locking screw, be provided with the first groove of encapsulation on the clamping part, the both sides that just encapsulate first groove still are provided with step A and step B respectively, still be provided with locking screw on the tip of the at least one end of clamping part, locking screw is just to encapsulating first groove, just locking screw's end runs through the first inslot of encapsulation. The utility model discloses a to encapsulate the head arranges the first inslot of encapsulation in to wash again after coming locking encapsulation head through locking screw, solved the encapsulation head and broken away from tweezers easily, easily scalded the potential safety hazard of hand, adopt the bakelite clamping part to have good thermal -insulated effect, only need during the use to encapsulate in the head puts into the groove, then turn round tight locking screw can the built -in package head, the step is few, convenient to use makes the encapsulation head work of wasing become simple and safety, and has improved the speed of wasing the encapsulation head. |
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