Cooling device is used in polishing of two -sided chemical mechanical polishing of wafer

The utility model discloses a cooling device is used in polishing of two -sided chemical mechanical polishing of wafer, including locating cooling body, governing system and the display control system on the grinding -and -polishing machine structure, the cooling body passes through cooling channel and forms the cooling chamber including cooling disk body, the inside of cooling disk body, and cooling channel includes the cyclic annular corrugated passageway in inner circle annular passageway of circle and outer lane. The utility model discloses simple structure, convenient operation, the coolant liquid is followed specific cooling channel and is carried out forced cooling to lower mill, has controlled the processing temperature of wafer effectively, has improved wafer grinding and polishing's surface quality, has reduced wafer piece probability.