Packaging structure

The utility model provides a packaging structure, packaging structure includes: chip unit, chip unit's first surface includes induction area, the upper cover plate, the first surface of upper cover plate has bearing structure, the upper cover plate covers chip unit's first surface, bearing structure is located the upper cover plate with between the chip unit, just induction area is located bearing structure with within the cavity that chip unit's first surface encloses, wherein, the upper cover plate has the thickness of predetermineeing, makes and follows the light of the lateral wall reflection of upper cover plate can not the direct irradiation induction area. The utility model discloses a packaging structure can reduce incident extremely induction area's interference light.