Aluminium base copper -clad plate of high heat dissipation metal
The utility model discloses aluminium base copper -clad plate of high heat dissipation metal relates to heat dissipation technical field. With " it glues to set up high heat dissipation " key technology, its copper foil layer, high heat -conducting medium layer, aluminium base board, high...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The utility model discloses aluminium base copper -clad plate of high heat dissipation metal relates to heat dissipation technical field. With " it glues to set up high heat dissipation " key technology, its copper foil layer, high heat -conducting medium layer, aluminium base board, high heat dissipation glue film bond in proper order. Be used for the heat dissipation. Technology is simple, effectual, with low costs, sharp to be promoted. |
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