Wrap -around wafer level semiconductor package structures that incline more

The utility model discloses a wrap -around wafer level semiconductor package structures that incline more contains a chip main part, a plurality of lug, a moulding -die glue film and a gum layer. The chip main part has an initiative face, a back and a plurality ofly connects the pad on this initiative face. Connect the pad to reshuffle the line layer with one and connect, be formed with a wafer protective layer on the initiative face to the cover line layer of reshuffling, the wafer protective layer has the corner incisxal edge that contracts in a plurality of in initiative plane angle corner department. The lug sets up and stacks up in connecing. The moulding -die glue film is the corner incisxal edge that contracts on the wafer protective layer and in the cladding to the local sealed lug of moulding -die glue film. The gum layer is on the back. The utility model provides a problem that the chip was peeled off at the plane angle corner department wafer protective layer of taking the initiative is so as to the reliable degree that improves the encapsulation product.