Heat dissipation LED packaging structure

The utility model discloses a heat dissipation LED packaging structure, including the base member, install the chip on this base member, be equipped with a plurality of through -holes that run through its upper and lower surface on this base member, the lower surface of this base member is equipped with the radiating part, is equipped with the heat dissipation space in this radiating part, and space and through -hole intercommunication should dispel the heat, LED packaging structure still includes extension, the extending direction of this extension and the plane bevel or the perpendicular setting at radiating part place, be equipped with the heat exchange space in this extension, this heat exchange space and heat dissipation space and outside intercommunication. The utility model discloses in, lead to radiating part, extension, the design of the portion of bending etc. Improved the radiating effect of chip greatly, also avoid impurity such as external rainwater to get into, through the design of a silica gel euphotic layer, second silica gel euphotic layer, phosphor powder etc. Can adjust LED packaging structure's luminous angle, enlarge the light emitting area, improve display quality.