Multilayer microwave digit composite substrate
Not enough to composite substrate, the utility model provides a multilayer microwave digit composite substrate: lower digital multiply wood, microwave multiply wood and last digital multiply wood triplex by from bottom to top constitute, wherein, digital multiply wood comprises the lower digit plywo...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Not enough to composite substrate, the utility model provides a multilayer microwave digit composite substrate: lower digital multiply wood, microwave multiply wood and last digital multiply wood triplex by from bottom to top constitute, wherein, digital multiply wood comprises the lower digit plywood in place more than 2 layers down, it comprises the last digital in place plywood more than 2 layers to go up digital multiply wood, the microwave multiply wood contains microwave inner plating and lower microwave inner plating, profitable technological effect: the utility model discloses function originally needing three PCB base plates to realize microwave telecommunication, microwave control, power supply respectively realizes through a composite substrate. The utility model discloses a rivet hole, cotter hole, guarantee down digital multiply wood, microwave multiply wood jointly and go up multiple -plate counterpoints of numeral accurate to temperature scale target figure and compound lamination counterpoint mode, solved because the inclined to one side problem in slide layer that has led to the fact owing to the bonding sheet flow during the inclined to one side and compound lamination of graph layer that material coefficient of expansion difference led to the fact. |
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