Lead frame structure

Lead frame structure

The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHAO QINGTIAN, LIN MENGHUI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZHAO QINGTIAN
LIN MENGHUI
description The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portion and third to meet pad portion. The first pad portion that connects has the holding region, and the holding region is used for setting up the first electrode of chip and electric connection chip. The second connects pad portion to have at least one and is coupled the region, is coupled the one end that regional electric connection switched on in the chip, other end electric connection an in second electrode of chip that the chip switched on. The third connects pad portion for the third electrode via wire electric connection chip. The lead frame unit is separated first pad portion, the second of connecing with an at least clearance and is connect pad portion and third to meet pad portion.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN204834613UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN204834613UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN204834613UU3</originalsourceid><addsrcrecordid>eNrjZBDxSU1MUUgrSsxNVSguKSpNLiktSuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkYGJhbGJmaGxqGhxkQpAgCJ1SF_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Lead frame structure</title><source>esp@cenet</source><creator>ZHAO QINGTIAN ; LIN MENGHUI</creator><creatorcontrib>ZHAO QINGTIAN ; LIN MENGHUI</creatorcontrib><description>The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portion and third to meet pad portion. The first pad portion that connects has the holding region, and the holding region is used for setting up the first electrode of chip and electric connection chip. The second connects pad portion to have at least one and is coupled the region, is coupled the one end that regional electric connection switched on in the chip, other end electric connection an in second electrode of chip that the chip switched on. The third connects pad portion for the third electrode via wire electric connection chip. The lead frame unit is separated first pad portion, the second of connecing with an at least clearance and is connect pad portion and third to meet pad portion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151202&amp;DB=EPODOC&amp;CC=CN&amp;NR=204834613U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151202&amp;DB=EPODOC&amp;CC=CN&amp;NR=204834613U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO QINGTIAN</creatorcontrib><creatorcontrib>LIN MENGHUI</creatorcontrib><title>Lead frame structure</title><description>The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portion and third to meet pad portion. The first pad portion that connects has the holding region, and the holding region is used for setting up the first electrode of chip and electric connection chip. The second connects pad portion to have at least one and is coupled the region, is coupled the one end that regional electric connection switched on in the chip, other end electric connection an in second electrode of chip that the chip switched on. The third connects pad portion for the third electrode via wire electric connection chip. The lead frame unit is separated first pad portion, the second of connecing with an at least clearance and is connect pad portion and third to meet pad portion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDxSU1MUUgrSsxNVSguKSpNLiktSuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkYGJhbGJmaGxqGhxkQpAgCJ1SF_</recordid><startdate>20151202</startdate><enddate>20151202</enddate><creator>ZHAO QINGTIAN</creator><creator>LIN MENGHUI</creator><scope>EVB</scope></search><sort><creationdate>20151202</creationdate><title>Lead frame structure</title><author>ZHAO QINGTIAN ; LIN MENGHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN204834613UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAO QINGTIAN</creatorcontrib><creatorcontrib>LIN MENGHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAO QINGTIAN</au><au>LIN MENGHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Lead frame structure</title><date>2015-12-02</date><risdate>2015</risdate><abstract>The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portion and third to meet pad portion. The first pad portion that connects has the holding region, and the holding region is used for setting up the first electrode of chip and electric connection chip. The second connects pad portion to have at least one and is coupled the region, is coupled the one end that regional electric connection switched on in the chip, other end electric connection an in second electrode of chip that the chip switched on. The third connects pad portion for the third electrode via wire electric connection chip. The lead frame unit is separated first pad portion, the second of connecing with an at least clearance and is connect pad portion and third to meet pad portion.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_CN204834613UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Lead frame structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T11%3A34%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHAO%20QINGTIAN&rft.date=2015-12-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN204834613UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true