Lead frame structure
The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portio...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The utility model provides a lead frame structure, has at least one lead frame unit, and each lead frame unit is used for electric connection between chip and at least one outside electrical property contact. Each lead frame unit has first pad portion, the second of connecing and connects pad portion and third to meet pad portion. The first pad portion that connects has the holding region, and the holding region is used for setting up the first electrode of chip and electric connection chip. The second connects pad portion to have at least one and is coupled the region, is coupled the one end that regional electric connection switched on in the chip, other end electric connection an in second electrode of chip that the chip switched on. The third connects pad portion for the third electrode via wire electric connection chip. The lead frame unit is separated first pad portion, the second of connecing with an at least clearance and is connect pad portion and third to meet pad portion. |
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