A cooling device and electric installation for cooling off semiconductor module
The utility model relates to a cooling semiconductor module's (10) cooling device, semiconductor module has bottom plate (11) and at least one semiconductor that has above -mentioned (111), following (112) and four side (113), the semiconductor install on the higher authority of bottom plate an...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The utility model relates to a cooling semiconductor module's (10) cooling device, semiconductor module has bottom plate (11) and at least one semiconductor that has above -mentioned (111), following (112) and four side (113), the semiconductor install on the higher authority of bottom plate and with the bottom plate hot link, cooling device has at least one cooling component (20), the cooling component has first fitting surface (21) and second fitting surface (22), first fitting surface is set to on the following (112) of bottom plate (11) of supporting semiconductor module (10), the second fitting surface is set to on side (113) of bottom plate (11) of supporting semiconductor module (10). Furthermore, the utility model relates to an electric installation. |
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