Sapphire and chip be fingerprint sensor packaging structure of laminating earlier

The utility model relates to a sapphire and chip be fingerprint sensor packaging structure of laminating earlier, it includes outer becket (1), be provided with sapphire (2) in outer becket (1), sapphire (2) back is provided with sensing chip (4), sensing chip (4) surface is provided with circuit board (6) and chip (8), chip (8) surperficial and gate board (6) are connected through bonding wire (11) between the surface, it inserts (12) to be provided with components and parts (7) and row on circuit board (6), outer becket (1) bottom is provided with metal soleplate (10), it has plastic envelope material (9) to fill between sapphire (2) and metal soleplate (10). The utility model relates to a sapphire and chip be fingerprint sensor packaging structure of laminating earlier, it uses sapphire and becket module as the base plate, pastes the dress with sensing chip and on the sapphire, has guaranteed the laminating quality of sapphire with sensing chip, has improved the equipment yield greatly.