DDR3 memory chip

The utility model provides a DDR3 memory chip, including wafer chip I, brilliant first chip II, epoxy, circuit substrate, epoxy, gold thread, tin ball, the circuit substrate upper surface is provided with two mutual superimposed wafer chips I, brilliant first chip II, the circuit substrate passes through the gold thread and is connected with wafer chip I, brilliant first chip II respectively, circuit substrate and brilliant first chip have epoxy between II, the circuit substrate below is connected with the tin ball, wafer chip I and brilliant first chip have epoxy between II, said wafer chip I has epoxy with II outside claddings of brilliant first chip, uses 2 chips paster and bonded technique simultaneously, and the improve equipment utilization ratio reduces the cost of labor.