Back of the body chamber enlarges the micro electronmechanical microphone packaging structure of the stereo array of formula

The utility model discloses a back of the body chamber enlarges the micro electronmechanical microphone packaging structure of the stereo array of style contains a micro electronmechanical chip, a ray of road bed board, a cyclic annular frame and the back of the body chamber expansion cover of gluing. The verso of micro electronmechanical chip is formed with an opening and is equipped with the array air vent towards the out-of-the-way chamber cave of verso, the bottom in back of the body chamber cave, and chip initiative face is provided with the pressure membrane. The circuit base plate has the outer sound hole that runs through, and the circuit base plate is in order to stay the clearance mode to laminate in the initiative face of micro electronmechanical chip. The cyclic annular micro electronmechanical chip and gate base plate of frame bonding of gluing. Back of the body chamber enlarges the cover and combines in the verso of micro electronmechanical chip to back of the body chamber enlarges the cover space that the cover has an indent, so that back of the body chamber cave is the airtight out-of-the-way chamber space of an expansion style with the cover spatial structure. The micro electronmechanical microphone chip of event integrative array is in the CSP and have the advantage that airtight out-of-the-way chamber enlarges.