The grooved fingerprint sensor packaging structure of sapphire

The utility model relates to a grooved fingerprint sensor packaging structure of sapphire, it includes base plate (3), base plate (3) are positive is provided with sensing chip (5), sensing chip (5) openly with between base plate (3) the front are connected by bonding wire (10) mutually, sensing chi...

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Bibliographische Detailangaben
Hauptverfasser: WANG SUNYAN, LIANG XINFU, ZHANG JIANGHUA
Format: Patent
Sprache:eng
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Zusammenfassung:The utility model relates to a grooved fingerprint sensor packaging structure of sapphire, it includes base plate (3), base plate (3) are positive is provided with sensing chip (5), sensing chip (5) openly with between base plate (3) the front are connected by bonding wire (10) mutually, sensing chip (5) are positive is provided with sapphire (8), sapphire (8) verso is peripheral is provided with recess (9), base plate (3) verso is provided with chip (14) and component (11), base plate (3) below is provided with flexible printed wiring board (12), be connected mutually by piercing through molding through-hole (2) between base plate (3) verso and the flexible printed wiring board (12). The utility model relates to a grooved fingerprint sensor packaging structure of sapphire, its technology is comparatively simple, avoids losing sensing chip, can reduce the distance between chip induction zone and the sapphire simultaneously, makes fingerprint identification's packaging structure have high sensitivity.