Blanking clamp component of chip-type integrated circuit material electroplating equipment

The utility model discloses a blanking clamp assembly of a chip-type integrated circuit material electroplating equipment. The blanking clamp assembly comprises a horizontal guide rail mechanism, a lifting mechanism, a mounting frame, a regulating mechanism, an adsorbing piece and two clamping pieces, wherein the lifting mechanism is slidably arranged at the lower side of the horizontal guide rail mechanism, the mounting frame is arranged at the lower end of the lifting mechanism and does lifting motion under the driving action of the lifting mechanism, the two clamping pieces are arranged at the lower side of the mounting frame and are oppositely arranged, the lower end of each of the two clamping pieces extends with a clamping hook used for clamping a sheet, the regulating mechanism is arranged on the mounting frame and acts on the two clamping pieces for regulating distance between the two clamping pieces, the adsorbing piece is arranged at the lower side of the mounting frame and is arranged between the two clamping pieces, and a sucking disc is arranged at the lower end of the adsorbing piece. The blanking clamp assembly disclosed by the utility model has the advantages that automatic blanking operation of the sheet can be realized in a sheet electroplating process, and the whole electroplating efficiency of the sheet is effectively improved.