Power module capable of adopting diamond-like film and aluminum baseplate
The utility model discloses a power module (including an IGBT, an MOSFE and a diode) capable of adopting a diamond-like film and an aluminum baseplate. The power module comprises a silica gel (1), a metal electrode (2), the aluminum baseplate (3), the diamond-like film (4), a copper film (5), solder...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The utility model discloses a power module (including an IGBT, an MOSFE and a diode) capable of adopting a diamond-like film and an aluminum baseplate. The power module comprises a silica gel (1), a metal electrode (2), the aluminum baseplate (3), the diamond-like film (4), a copper film (5), soldering paste (6), a power chip (7), and an aluminum wire (8). The power module is suitable for power devices such as the IGBI, the MOSFE and the diode. The diamond-like film (DLC) (4) and the aluminum baseplate (3) have the characteristics of being stable in material, good in insulativity and high in thermal conductivity, the thermal resistance and the package cost of the module are greatly reduced, and the traditional DBC package can be replaced. |
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