Glue dipping device for full-automatic capsule production line
The utility model relates to a glue dipping device for a full-automatic capsule production line. The glue dipping device comprises a glue dipping frame, a glue dipping slot, a push pawl, a mold and lifting trays, wherein the glue dipping frame is arranged right above the glue dipping slot and compri...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The utility model relates to a glue dipping device for a full-automatic capsule production line. The glue dipping device comprises a glue dipping frame, a glue dipping slot, a push pawl, a mold and lifting trays, wherein the glue dipping frame is arranged right above the glue dipping slot and comprises a top plate and a side plate; a guide rail is arranged at the inner side of the side plate, and both ends of the mold are positioned on the guide rail when the mold is pushed to the glue dipping frame by the push pawl; the lifting trays are respectively arranged at the front ends of the side plates at two sides of the glue dipping frame, and a guide groove is formed in the inner side of each lifting tray; the glue dipping frame can move up and down, when the glue dipping frame moves to the highest position, the front end of the guide rail overlaps with the rear end of the guide groove; a volute spiral spring is further arranged at the proper position of the side plate close to the front end, so that the front end of the mold comes into contact with the volute spiral spring when the mold is pushed to the guide groove. The volute spiral spring is arranged on the glue dipping device, and thus the slipping and dispersing phenomenon of the mold can be effectively reduced, equipment operation and product quality are steady and reliable. |
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