Water pump heat radiation device

The utility model relates to a water pump heat radiation device, which comprises a base arranged at the bottom of a water pump motor end, wherein the two sides of the base are respectively and symmetrically provided with a heat radiation pipe group covering the outer side of a water pump motor, a pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GAO HONGPEI, YIN KEJIN, DING ZENGJIA, ZHAO JIAN, MA LIN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to a water pump heat radiation device, which comprises a base arranged at the bottom of a water pump motor end, wherein the two sides of the base are respectively and symmetrically provided with a heat radiation pipe group covering the outer side of a water pump motor, a plurality of transverse pipes communicated with an inner cavity of each arc-shaped support frame are sequentially arranged between the two arc-shaped support frames from top to bottom at intervals, a water inlet is formed in the upper part of the side wall of the arc-shaped support frame near the water inlet end of the water pump, the water inlet is connected with a first one-way valve arranged on the side wall of the water pump water inlet end through a water pipe, a water outlet is formed in the lower part of the side wall of the corresponding arc-shaped support frame, the water outlet is connected with a second one-way valve arranged on the side wall of the water pump water outlet end through a water pipe, and a baffle plate is arranged in the middle part of the inner side of the corresponding arc-shaped support frame. The water pump heat radiation device has the advantages that the structure is simple, the heat radiation effect is good, the occurrence of water pump damage phenomenon due to too high temperature of the water pump can be avoided, the long-time use of the water pump is effectively ensured, and the service life of the water pump is greatly prolonged. The water pump heat radiation device can be applicable to the water pumps in various models, and the problems in the prior art are solved.