A liquid cooling type heat radiation apparatus for electronic equipment

A liquid cooling type heat radiation apparatus for electronic equipment comprises a heat absorption module, a liquid transmission module and a heat exchange module. The liquid transmission module has at least one liquid inlet pipe and at least one liquid outlet pipe. A first end of the liquid inlet pipe and a first end of the liquid outlet pipe are connected to the heat absorption module. The heat exchange module has a fin assembly, at least one heat radiation fan and a plurality of communicating pipe penetrating through the two ends of the fin assembly. A first end of the fin assembly is provided with a liquid storage chamber. A plurality of first spaces is arranged in the liquid storage chamber. First ends of the plurality of communicating pipes enter the plurality of first spaces. A second end of the fin assembly is provided with a plurality of second spaces. Second ends of the plurality of communicating pipes enter the plurality of second spaces. A second end of the liquid inlet pipe and a second end of the liquid outlet pipe are respectively connected to a first pump and a second pump. The first pump and the second pump are communicated with the first spaces of the liquid storage chamber.