Deep-shallow double groove structure

The utility model provides a deep-shallow double groove structure for solving the problems of the groove transverse etching distance and the etching efficiency in a deep groove etching technology. The deep-shallow double groove structure comprises a silicon wafer, a shallow groove etched on the surface of the silicon wafer, a deep groove etched at the bottom of the shallow groove, and a step is formed at the combination position of the shallow groove and the deep groove. The deep-shallow double groove structure of the utility model can finish the etching of a larger groove depth on the condition of the conventional equipment, enables the working time to be controlled in an acceptable range, effectively controls the degree of the groove transverse etching, and enables the subsequent processes to be suitable for the large groove depth condition on the condition of not changing the subsequent processes.