Leadless ball-foot surface-mount microwave thin film hybrid integrated circuit

A leadless ball-foot surface-mount microwave thin film hybrid integrated circuit is composed of a thin film ceramic wafer, a thin film conduction band, thin film stop bands, a thin film capacitor, a thin film inductor, a chip component, semiconductor bare chips and a pipe cap. Through holes are arranged between a front surface and a bottom surface of the thin film ceramic wafer. The thin film conduction band, the thin film stop bands, the thin film capacitor and the thin film inductor are integrated on the front surface of the thin film ceramic wafer, and the bottom surface of the thin film ceramic wafer has an insulation medium thin film. The bottom surface of the thin film ceramic wafer is a ball-foot-type external coupling end. The pipe cap is attached on the front surface of the thin film ceramic wafer. Semiconductor chips comprise a normally-mounted semiconductor bare chip and a flip semiconductor bare chip, the normally-mounted semiconductor bare chip has bonding wires connected with the thin film stop bands, and a ball foot of the flip semiconductor bare chip is welded with a ball foot of a metal ball. An outer layer of the pipe cap is a metal layer, and an inner wall of the pipe cap is painted with a ceramic coating layer. The leadless ball-foot surface-mount microwave thin film hybrid integrated circuit can be widely applied to fields such as spaceflight, aviation, ships, electron, communication, medical equipment and industrial control, and is particularly suitable for fields of equipment system miniaturization.