Electronic device

An electronic device comprising a substrate wafer made of a plurality of insulating material layers, and the substrate wafer comprises an electric connection network. An integrated circuit chip is mounted on the top side of the substrate wafer. The substrate wafer comprises a metal plate which is in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ALEXANDRE COULLOMB
Format: Patent
Sprache:eng
Schlagworte:
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