Electronic device
An electronic device comprising a substrate wafer made of a plurality of insulating material layers, and the substrate wafer comprises an electric connection network. An integrated circuit chip is mounted on the top side of the substrate wafer. The substrate wafer comprises a metal plate which is in...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronic device comprising a substrate wafer made of a plurality of insulating material layers, and the substrate wafer comprises an electric connection network. An integrated circuit chip is mounted on the top side of the substrate wafer. The substrate wafer comprises a metal plate which is integrated in the substrate wafer and is thermally coupled to the integrated circuit chip. The thickness of the metal plate can exceeds the thickness of the plurality layers of the substrate wafer. The metal plate can comprise a guide tube through which a heat conduction fluid flows. |
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