Image sensor unit, image reading apparatus, and paper-like object identification apparatus

The utility model provides an image sensor unit, an image reading apparatus, and a paper-like object identification apparatus. A circuit board having a mounting surface with a plurality of light sources is connected to a sensor substrate, so that the image sensor unit can be assembled easily. The im...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIDEMASA YOSHIDA, JUNYA KINOSHITA, HIDEHISA TAKAHASHI, SHUUICHI SHIMODA, YOSHIO KUREISHI, AKIFUMI FUJIWARA, SUGURU TASHIRO, YOSHIHIKO TSUMEKAWA, RYOKI MATSUI, TAKASHI CHIBA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model provides an image sensor unit, an image reading apparatus, and a paper-like object identification apparatus. A circuit board having a mounting surface with a plurality of light sources is connected to a sensor substrate, so that the image sensor unit can be assembled easily. The image sensor unit comprises a plurality of light sources, a plurality of optical conductors, an image sensor, a sensor substrate, and a circuit board. The multiple light sources have respective LED chips. The incident surfaces of the multiple optical conductors at one side of the length direction are arranged in parallel by facing the multiple light sources; and light from the multiple light sources is guided to paper money. The image sensor converts light from the paper money into an electric signal. The sensor substrate is provided with the image sensor. Multiple light sources are installed at the same mounting surface of the circuit board; one sides of the multiple optical conductors at the length direction are arranged at the sensor substrate; a connecting hole is formed in one side of the sensor substrate at the length direction of the sensor substrate; and a connected portion with a plurality of external connection welding plates is connected to the connecting hole and thus the circuit board is connected to the sensor substrate.