High temperature power source module

The utility model discloses a high temperature power source module and belongs to the field of semiconductor devices. The high temperature power source module comprises a base plate, an outer shell, central columns and insulating central columns, wherein three modules are arranged on the base plate; two left and right modules are the same chip modules, and the middle module is a central module which is positioned on the central position of the base plate; the two left and right modules are positioned at two sides, at the same distance from the central module, of the central module; the outer shell is connected on the base plate through pins and encloses the three modules; an epoxy resin is embedded in a gap between the outer shell and the three modules; the chip modules are provided with screws, central columns, insulating central columns, first welding sheets, spring sheets, second welding sheets, gold-plated molybdenum sheet, third welding sheets, chips, fourth welding sheets, nickel-plated molybdenum sheet