High-reflectivity circuit board achieving electro-thermal separation and integrated with LED chips

A high-reflectivity circuit board achieving electro-thermal separation and integrated with LED chips comprises a heat dissipating layer, an insulating layer and a circuit layer which are in press fit sequentially. One surface of the heat dissipating layer contacting the insulating layer is mirror al...

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Bibliographische Detailangaben
1. Verfasser:	CHEN NUOCHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A high-reflectivity circuit board achieving electro-thermal separation and integrated with LED chips comprises a heat dissipating layer, an insulating layer and a circuit layer which are in press fit sequentially. One surface of the heat dissipating layer contacting the insulating layer is mirror aluminum. The circuit layer is provided with at least one hole slot communicated to the mirror aluminum. At least one LED chip is arranged on the mirror aluminum in the hole slot. The circuit layer is provided with at least one LED solder joint. The LED solder joints are independent of one another and are arranged outside the hole slot. The pole P and the pole N of the LED chip are respectively connected with the LED solder joints through gold wires. The circuit layer is further provided with a positive electrode and a negative electrode which are connected with each of the LED solder joints through a circuit.