High-luminous efficiency circuit board of integrated LED chip

A high-luminous efficiency circuit board of an integrated LED chip comprises a heat dissipating layer, an insulating layer and a circuit layer, which are in press fit sequentially. At least one LED chip solder joint, a positive electrode and a negative electrode are distributed on the circuit layer. Each of the LED chip solder joints is connected with the positive electrode and the negative electrode through a circuit. The insulating layer is coated with a solder resist coating which exposes the circuit layer. The solder resist coating and the circuit layer are coated with a silica gel ink coating. The LED chip solder joints, the positive electrode and the negative electrode are exposed and isolated from each other. The high-luminous efficiency circuit board further comprises an LED chip arranged on the LED chip solder joints.