Soldering flux dipping device for LED circuit board soldering

The utility model discloses a soldering flux dipping device for LED circuit board soldering. The device comprises a fluid storage tank for allowing a circuit board to be dipped with soldering flux, and further comprises a fluid collection tank and a fluid delivery pump. The fluid collection tank is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PAN YANGZHOU, PAN YINLONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The utility model discloses a soldering flux dipping device for LED circuit board soldering. The device comprises a fluid storage tank for allowing a circuit board to be dipped with soldering flux, and further comprises a fluid collection tank and a fluid delivery pump. The fluid collection tank is located below the fluid storage tank and used for collecting the soldering flux overflowing the fluid storage tank, and the fluid delivery pump is used for delivering the soldering flux in the fluid collection tank to the fluid storage tank. According to the soldering flux dipping device for LED circuit board soldering, the liquid level height of the soldering flux remains unchanged, so that it is guaranteed that the circuit board can be dipped with soldering flux at a proper height as long as the dipping position of the circuit board is not changed, consistency of soldering of various circuit boards is improved, and product quality is improved.