Light-emitting device, lighting source, and lighting device

The utility model relates to a light-emitting device, a lighting source, and a lighting device. The light-emitting device (LED module (10)) comprises an elongated-shaped substrate (11); an LED element (12), which is disposed on the first main surface of the substrate (11); a first metal pattern (wir...

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Bibliographische Detailangaben
Hauptverfasser:	MASAKI KIBE, MAKOTO HORIUCHI, HIROKI KITAGAWA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE NON-PORTABLE LIGHTING DEVICES PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	The utility model relates to a light-emitting device, a lighting source, and a lighting device. The light-emitting device (LED module (10)) comprises an elongated-shaped substrate (11); an LED element (12), which is disposed on the first main surface of the substrate (11); a first metal pattern (wiring (13)), which is disposed on the first main surface of the substrate (11), and is electrically connected with the LED element (12); and a second metal pattern (metal pattern (14)), which is disposed on the second main surface of the substrate (11) opposite to the first main surface, and is used as the non-wiring structure.