SMD LED packaging structure

The utility model discloses a SMD LED packaging structure comprising a heat-dissipating support and an LED chip in the groove of the heat-dissipating support. A lens is disposed outside the LED chip. The LED chip is disposed on the bottom in the groove of the heat-dissipating support and is fixed by...

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Bibliographische Detailangaben
Hauptverfasser:	TONG HUA'NAN, LI FAN, CHEN JIANCHANG, ZHANG JING, LIANG TIANJING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The utility model discloses a SMD LED packaging structure comprising a heat-dissipating support and an LED chip in the groove of the heat-dissipating support. A lens is disposed outside the LED chip. The LED chip is disposed on the bottom in the groove of the heat-dissipating support and is fixed by wafer fixing adhesive. A fluorescent glue film layer isolated from the lens covering the LED chip is arranged on the top of the groove. The SMD LED packaging structure improves the light outgoing efficiency of a blue-light chip, prevents a deposition phenomenon caused by fluorescent powders coating the surface of the chip, and improves the brightness and the uniformity of the SMD LED lamp beads.