Heat pipe type efficient semiconductor refrigeration device

The utility model discloses a heat pipe type efficient semiconductor refrigeration device. The heat pipe type efficient semiconductor refrigeration device comprises a hot end heat pipe radiator, a hot end bottom plate, a liquid pipe and an air pipe. One end of the hot end heat pipe radiator and one end of the hot end bottom plate are respectively connected with the liquid pipe, the other end of the hot end heat pipe radiator and the other end of the hot end bottom plate are respectively connected with the air pipe, a TEC refrigeration sheet is arranged on the hot end bottom plate, the faces, except the face provided with the TEC refrigeration sheet, of the hot end bottom plate are covered with heat-insulating layers, the TEC refrigeration sheet is connected with a cold end profile radiator, a first fan is arranged beside the cold end profile radiator, and a second fan is arranged beside the hot end heat pipe radiator. The heat pipe type efficient semiconductor refrigeration device is suitable for high-temperature environments, the cold and hot section temperature difference is reduced, and refrigeration efficiency is improved; flow resistance of gas-state and liquid-state working media inside a heat pipe is reduced and heat exchange efficiency is improved; heat transfer resistance is reduced to the maximum degree; a super-high power semiconductor refrigerator is convenient to design and manufacture.