Washing and cooling device used for semiconductor cutting equipment

The utility model provides a washing and cooling device used for semiconductor cutting equipment. The washing and cooling device comprises a spray head body provided with a fluid containing cavity and at least one air pipe connector and at least two water pipe connectors, and the air pipe connector and the water pipe connectors are communicated with the fluid containing cavity; a first air and water two-flow nozzle, a second air and water two-flow nozzle and a third air and water two-flow nozzle are formed in the outer wall of the spray head body and sequentially arranged in the same vertical linear direction, the first air and water two-flow nozzle is used for spraying out water flow or air flow to remove waste residue on the semiconductor cutting equipment, the second air and water two-flow nozzle is used for spraying out water flow or air flow to cool the semiconductor cutting equipment, and the third air and water two-flow nozzle is used for spraying out water flow or air flow to remove the waste residue on the semiconductor cutting equipment. Compressed air and water are connected externally, two kinds of flow can be formed in the spray head body and pass through all the nozzles to clear dirt and cool the semiconductor cutting equipment, and therefore the problem that an existing extensional nozzle is prone to deforming is avoided.