Packaging structure of integrated drive circuit of brushless direct current motor

The utility model relates to a packaging structure of an integrated drive circuit of a brushless direct current motor. The package structure includes a lead frame, a plurality of chips are adhered to a base island of the lead frame and electrically connected with the lead frame, and the chips and the lead frame are packaged through packaging plastic and then solidified. According to the package structure in the utility model, three IC chips and six field-effect tubes are packaged in the same circuit, and thus the integrated drive circuit of the brushless direct current motor is obtained, thereby greatly simplifying design of an application circuit, improving the integration level of the application circuit, improving stability and reliability of the application circuit, and decreasing the volume of the drive circuit. According to the package structure of the integrated drive circuit of the brushless direct current motor in the utility model, screening of electrical parameters of a device is not needed, cost can be reduced obviously, and production efficiency can be improved.