Spray groove of silicon rod wafer precleaning degumming machine

A spray groove of a silicon rod wafer precleaning degumming machine comprises a groove body, wherein a groove cavity is formed in the groove body; a bracket is arranged in the groove cavity longitudinally; two sides of the bracket are provided with spray rods in a manner of being parallel to the bracket; the spray rods are connected with a water outlet of a water pump flushing system of the wafer precleaning degumming machine; the spray groove also comprises swing devices; the swing devices are connected with the spray rods; the spray rods can rotate around the axes of the swing devices; the swing devices drive the spray rods to rotate back and forth to enable water flow to be spayed onto monocrystalline silicon wafers. The spray groove, disclosed by the utility model, can flush the silicon wafers better by regulating the spray angles of the spray rods continuously, and the problems of occurrence of oxidation, spots and the like of the silicon wafers in the subsequent process are prevented.