Inverted LED integrated substrate

The utility model discloses an inverted LED integrated substrate which comprises a substrate body, substrate welding points, a plurality of LED chips and substrate wires, wherein the substrate welding points and the LED chips are arranged on the substrate, the substrate welding points include an ano...

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Bibliographische Detailangaben
Hauptverfasser: LI WENBO, MIAO YONGBIN, ZOU JUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses an inverted LED integrated substrate which comprises a substrate body, substrate welding points, a plurality of LED chips and substrate wires, wherein the substrate welding points and the LED chips are arranged on the substrate, the substrate welding points include an anode welding point and a cathode welding point, and two ends of the LED chips are connected with the anode welding point or the cathode welding point respectively through the substrate wires. The LED chips are inverted, each LED chip comprises two supports identical in dimension, conductive adhesives are coated at close ends of the supports and used for allowing the substrate body to be connected with PN junctions, sapphires are arranged on the PN junctions, end faces of the bottom ends of the sapphires are connected with top surfaces of the PN junctions, and a layer of fluorescent powder is coated on the end face of the top end of each sapphire. The inverted LED integrated substrate is small in thermal resistance an