Air bubble removal device for thick copper boards after solder resist printing
The utility model discloses an air bubble removal device for thick copper boards after solder resist printing. The air bubble removal device comprises a rack, wherein a vacuum cavity chamber is arranged on the rack, a vacuum pump is arranged under the vacuum cavity chamber and connected with the sam...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses an air bubble removal device for thick copper boards after solder resist printing. The air bubble removal device comprises a rack, wherein a vacuum cavity chamber is arranged on the rack, a vacuum pump is arranged under the vacuum cavity chamber and connected with the same through a hose, the vacuum cavity chamber comprises a seal door on which a transparent window is arranged, the seal door is hinged to one side of the vacuum cavity chamber, and an electric control cabinet is arranged on the other side of the vacuum cavity chamber. The air bubble removal device for thick copper boards after solder resist printing has the advantages of reducing standing time of the thick copper boards after solder resist printing, improving work efficiency and improving solder resist printing quality of the thick copper boards. |
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