Release paster

The utility model belongs to the technical field of flexible circuit board assembling, and especially relates to a release paster. The release paster comprises a plurality of bonding strips and a piece of release paper, wherein the plurality of bonding strips are used for bonding electronic elements, and the release paper is used for fixedly bonding the bonding strips. The bonding strips are arranged in a laminated, staggered and bonded manner and are bonded to the release paper. Each bonding strip comprises a base material, a first glue layer coated on the upper surface of the base material, a second glue layer coated on the lower surface of the base material, and an anti-sticking film covering the surface of the first glue layer. The bonding strip arranged on the lowest layer is bonded to the release paper through the second glue layer. Each bonding strip arranged above the bonding strip on the lowest layer is bonded to the anti-sticking film of the below bonding strip through one end of the second glue lay