Any layer interconnectable HDI (high density interconnectable) board

The utility model provides an any layer interconnectable HDI (high density interconnectable) board, which comprises an inner board, wherein the inner board is provided with a plurality of buried holes, and the upper and lower sides of the inner board are provided with a plurality of outer boards whi...

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Hauptverfasser: WEN ZESHENG, DENG SIJI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model provides an any layer interconnectable HDI (high density interconnectable) board, which comprises an inner board, wherein the inner board is provided with a plurality of buried holes, and the upper and lower sides of the inner board are provided with a plurality of outer boards which take the inner board as a symmetric board; each of the outer boards is provided with a plurality of tapered blind holes, the number of the tapered blind holes decreases progressively in the direction from the outer boards to the inner board, and the position and the number of the tapered blind holes in the outer board, which is contacted with the inner board are in one-to-one correspondence to that of the buried holes. As the any layer interconnectable HDI board provided by the utility model adopts the tapered blind holes and the tapered blind holes of each layer are enabled to be correspondingly combined through a layered overlaying mode, so that a problem that the hole depth and the hole diameter of the blind