Semiconductor product surface mount type molding stamping die and stamping die system

The utility model relates to a semiconductor product surface mount type molding stamping die. The semiconductor product surface mount type molding stamping die comprises an upper die and a lower die which are arranged one above the other, wherein a stamping wedge is arranged on the upper die; the lower die comprises a female die for accommodating a semiconductor; the lower die is provided with a swing block capable of rotating leftwards and rightwards; the swing block is arranged corresponding to the stamping wedge; the stamping wedge is contacted with the swing block in a die assembly process; the surface, which is contacted with the swing block, of the stamping wedge is an inclined surface. The semiconductor product surface mount type molding stamping die system comprises a semiconductor product surface mount type molding stamping die without a pressure block and a semiconductor product surface mount type molding stamping die with a pressure block which are arranged in series; the latter is positioned on th