LED flip-chip structure

The utility model provides an LED flip-chip structure. The structure comprises a substrate, a soldering paste layer and an LED chip. The substrate includes a chip fixing area which has concaves and convexes on the surface. The soldering paste layer coats the surface of the chip fixing area, and covers the concaves and convexes. An LED chip is arranged in the chip fixing area, and a P-type electrode and an N-type electrode of the LED chip are bonded with the soldering paste layer. The beneficial effects of the LED flip-chip structure provided by the utility model are that the surface area of the chip fixing area is increased by the concaves and convexes of the chip fixing area, i.e. the contact area of the soldering paste layer and the substrate is increased, so that the bonding strength of the interface of the soldering paste layer and the substrate is increased; the concaves and convexes facilitate the discharge of gas between the interfaces, thereby reducing gas holes; the soldering paste layer is used inst