Electroplating device applied to tin-plating machine

The utility model discloses an electroplating device applied to a tin-plating machine. The electroplating device comprises an electroplating trough frame, an electroplating trough is arranged on the upper end portion of the electroplating trough frame, a negative electrode roller is arranged on one side of the wire input end of the electroplating trough frame, the negative electrode roller is arranged on a corresponding roller support through a bearing pedestal, and an insulating rubber pad is arranged between the bottom of the bearing pedestal and the roller support; the electroplating trough frame is provided with at least two copper rafters above the electroplating trough, the copper rafters are electrically connected with a positive electrode power source, and each copper rafter is provided with a tin block stretching into an electrolyte. A bare copper wire is conveyed into the electroplating troughs by passing through the negative electrode roller, wherein the bare copper wire is a negative electrode; th