Connection structure for rigid substrate and flexible substrate

The utility model relates to a connection structure for a rigid substrate and a flexible substrate, which is simple in connection procedure, and can prevent connection parts from stripping off. The connection structure is characterized by comprising through holes (54a), through holes (1103a) and an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OTSU HARUHIKO, SATO AKIHIRO, ASANO MASAHIRO, SASAKI KAZUYA, OKANISHI NORIMASA, KENETSU MATSUKAWA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to a connection structure for a rigid substrate and a flexible substrate, which is simple in connection procedure, and can prevent connection parts from stripping off. The connection structure is characterized by comprising through holes (54a), through holes (1103a) and an attachment (12), wherein the through holes (54a) are respectively formed in multiple connection parts (54) of the rigid substrate (5); the through holes (1103a) are correspondingly formed in multiple connection parts (1103) of a flexible printed circuit (FPC); and the attachment (12) includes cylindrical parts (1202) inserted into the through holes (54a, 1103a) and plate-shaped parts (1201), and the cylindrical parts (1202) are respectively formed on one surface of the plate-shaped portions (1201), so that when the connection parts (54) abut against the connection parts (1103), the cylindrical parts (1202) penetrate into the through holes (54a, 1103a), front ends of the cylindrical parts (1202) are riveted on the r