Packaging substrate

The utility model provides a packaging substrate including a substrate body provided with a plurality of electric contact gaskets, an insulating protection layer formed on the substrate body and exposing the electric contact gaskets and conducting posts arranged on the electric contact gaskets. The...

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Bibliographische Detailangaben
Hauptverfasser:	LIN JUNTING, XIE YUZHONG, WANG YINTONG, ZHAN YINGZHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The utility model provides a packaging substrate including a substrate body provided with a plurality of electric contact gaskets, an insulating protection layer formed on the substrate body and exposing the electric contact gaskets and conducting posts arranged on the electric contact gaskets. The width of the bottom ends of the conducting posts is larger than the width of the top ends, so that the conducting posts are in A-shaped structures and no alar part structure is formed on the conducting posts. Thus, distances between joints are reduced and requirements for small intervals and multiple joints are satisfied.