Reinforcing splicing structure of inlaying stone with copper
The utility model discloses a reinforcing splicing structure of inlaying stone with copper. The reinforcing splicing structure of inlaying the stone with the copper comprises a first stone plate pattern splicing component (1), a copper plate pattern splicing component (2), and a second stone plate p...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a reinforcing splicing structure of inlaying stone with copper. The reinforcing splicing structure of inlaying the stone with the copper comprises a first stone plate pattern splicing component (1), a copper plate pattern splicing component (2), and a second stone plate pattern splicing component (3), wherein the back surface of the copper plate pattern splicing component (2) and the second stone plate pattern splicing component (3) are compounded and a compound copper plate pattern splicing component is formed, and the front surface appearance structure of the compound copper plate pattern splicing component and the front surface appearance structure of the first stone plate pattern splicing component (1) are complementary. The compound copper plate pattern splicing component and the first stone plate pattern splicing component (1) form an integrated surface of appearance of a product in a splicing mode. The reinforcing splicing structure of inlaying the stone with the copper can |
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